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Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction
Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction
2018
Sho Takeda
Hiroyuki Miki
Julien Fontaine
Matthieu Guibert
Hiroyuku Takeishi
Toshiyuki Takagi
Keywords:
Metallurgy
Composite material
Materials science
Copper
stress distribution
Correction
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