Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration

The thermal budget/integration challenges for SOLES have been investigated. A process window has been found that allows for the successful demonstration of a monolithically integrated III-V/Si differential amplifier. A method of increasing the integration flexibility of SOLES by introducing SiN x interlayers has been demonstrated. Future work will explore the increased thermal budget/integration flexibility of SOLES provided by incorporating embedded GaAs layers.