유기전자소자 적용을 위한 저온 공정용 배리어 박막 연구

Recently, semiconducting organic materials have been spotlighted as next-generation electronic materials based on their tunable electrical and optical properties, low-cost process, and flexibility. However, typical organic semiconductor materials are vulnerable to moisture and oxygen. Therefore, an encapsulation layer is essential for application of electronic devices. In this study, SiNx thin films deposited at process temperatures below 150 °C by plasma-enhanced chemical vapor deposition (PECVD) were characterized for application as an encapsulation layer on organic devices. A single structured SiNx thin film was optimized as an organic light-emitting diode (OLED) encapsulation layer at process temperature of 80 °C. The optimized SiNx film exhibited excellent water vapor transmission rate (WVTR) of less than 5 × 10-5 g/m2·day and transmittance of over 87.3% on the visible region with thickness of 1 μm. Application of the SiNx thin film on the top-emitting OLED showed that the PECVD process did not degrade the electrical properties of the device, and the OLED with SiNx exhibited improved operating lifetime.