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Failure Mechanisms in Flip-Chip Bonding on Stretchable Printed Electronics
Failure Mechanisms in Flip-Chip Bonding on Stretchable Printed Electronics
2021
Mohammad H. Behfar
Behnam Khorramdel
Arttu Korhonen
Elina Jansson
Aleksis Leinonen
Markus Tuomikoski
Matti Mäntysalo
Keywords:
Materials science
Optoelectronics
Printed electronics
Flip chip
failure mechanism
Correction
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