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Characteristic Validation of High-damping Printed Circuit Board Using Viscoelastic Adhesive Tape
Characteristic Validation of High-damping Printed Circuit Board Using Viscoelastic Adhesive Tape
2020
Shin Seokjin
Su-Hyeon Jeon
Soo-Jin Kang
Sung-Woo Park
Oh Hyun-Ung
Keywords:
Mechanical engineering
Adhesive
Printed circuit board
Engineering
Viscoelasticity
Control engineering
Correction
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