Design and Fabrication of 3D Interconnected Transmission Structure Based on TSV

In this paper, we design and fabricate a radio frequency (RF) signal transmission structure for a 3D stacked structure. Usually, this structure uses co-planar waveguide (CPW) and Through Silicon Via (TSV) to realize the horizontal and vertical RF signal transmission on the same interposer respectively. With the help of micro-bump, we can transport RF signal in a stacked structure. Furtherly, we design and fabricate a patch antenna with a stacked structure, fed by the structure we proposed. Through the measurement of the antenna, we determine the effectiveness of this transmission structure.