The environment for learning to program

This invention presents to the art novel heat curable adhesive systems and laminates bonded by the adhesive system. The heat curable adhesive system comprises a heat curable adhesive composition which is a dispersion of a specific polyester, a polyvinylchloride which is or includes a carboxylated polyvinyl chloride and a polyepoxide and a curing agent for the adhesive composition. Curing of the adhesive composition can be effected at relatively low activation temperatures which provides distinct advantages in preparing laminates particularly those involving thin sheets of polymeric material bonded to metal sheet materials.