High-Temperature Joining of Ceramics and Sapphire by Laser-Based Process

Ceramics and sapphire are housing materials that are resistant to extreme stress and used in extreme environments today. The necessary high temperatures in conventional joining procedures are not suitable for encapsulating components owing to the functional requirements. Therefore new technologies are being developed in order to achieve local and time-limited heat input into the joining zone and thus to reach the necessary joining temperature. This following paper deals with high-temperature joining with laser beams using high-temperature glass filler material e.g. glass solder. Even if the working temperature is above 450 °C, the filler material is referred to glass solder in scientific terminology. Practice-related examples demonstrate the experimental investigations on control of the process control as well as on joint formation and the resulting properties.