Sintering and properties of mechanical alloyed Ti3AlC2-Cu composites

Abstract Powder mixtures of Ti 3 AlC 2 and Cu (volume ratio: 60: 40) with refined microstructures were obtained by mechanical alloying. After milling for up to 10 h the coherent domain size of Cu and Ti 3 AlC 2 was reduced to 12 nm and 10 nm, respectively. Mechanical alloying induced reduction of melting point of Cu(Al) solid solution triggered liquid phase sintering at 950 °C resulting in a bimodal microstructure of Ti 3 AlC 2 -Cu(Al) composites with improved sintered density. The composite with nanoscale microstructure exhibits a low electrical resistance of (0.32±0.01)×10 −6  Ω·m and superior ultimate compressive strength of (1242±24) MPa, respectively. The excellent mechanical properties were attributed to solid solution strengthening effect, grain size effect and kink band formation as well as formation large amount of dimples.