Correlation based local measurement of small CTE for high temperature power electronics packaging

The image based displacement analysis called Digital Image Correlation (DIC) can be used as an alternative to classical TMA and other bulk methods to measure CTE-values of electronic packaging materials. By combining the operation of the thermally optimized commercial equipment EQUINOX from the company OMI and the correlation software VEDDAC of CWM GmbH Chemnitz, it was possible to develop a method to acquire anisotropic CTE values of specimens locally and with an accuracy of +/− 0.5*10 −6 /K over the entire value scale.