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Synthesis and Curing Behaviors of Dual Curable Temporary Bonding and Debonding Adhesives for 3D Multichip Packaging
Synthesis and Curing Behaviors of Dual Curable Temporary Bonding and Debonding Adhesives for 3D Multichip Packaging
2014
Seung-Woo Lee
Tae-Hyung Lee
Ji Won Park
Cho-Hee Park
Hyun-Joong Kim
Jak-Hak Lee
HyungJun Kim
Sung-Hun Lee
Seung-Man Kim
Jun-Yeob Song
Keywords:
Adhesive
Curing (food preservation)
Materials science
Forensic engineering
Composite material
Correction
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