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On the Thermal Management of 3D-ICs: From Backside to Volumetric Heat Removal
On the Thermal Management of 3D-ICs: From Backside to Volumetric Heat Removal
2019
Thomas Brunschwiler
Gerd Schlottig
Chin Lee Ong
Brian R. Burg
Arvind Sridhar
Keywords:
Nuclear engineering
Thermal management of electronic devices and systems
Materials science
Mechanical engineering
Finite element method
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