CAD/CAM system for LSI package design: InCASE

This paper describes a CAD/CAM system for LSI package design (InCASE). The InCASE provides integrated design environment for both an LSI package designer and an LSI chip designer. The LSI package designer can design packages efficiently with this InCASE system. The LSI chip designer can retrieve data of the optimum package via network from the database in which package designers have stored their design. By using the InCASE system, he can determine which package is the most suitable for his chip. When he cannot find a suitable package which meets assembly conditions, he can request new package development for his chip. Necessary data are sent to the package designer by the InCASE system. This system was applied to ASIC development where various packages were prepared for the same chip. The InCASE proved to be effective in improving design flow an d reducing the TAT (Turn Around Time) of the LSI package design