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Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS : Separation Method of Glass Layer
Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS : Separation Method of Glass Layer
2008
Y. Izawa
Yosuke Tsurumi
Shuji Tanaka
Hideyuki Kikuchi
Keichi Sueda
Yoshiki Nakata
Masayoshi Esashi
Noriaki Miyanaga
Masayuki Fujita
Keywords:
Wafer dicing
Stress (mechanics)
Debris
Laser
Composite material
Microelectromechanical systems
Materials science
laser assisted
Optoelectronics
separation method
low stress
Correction
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