An Integrative Reliability Prediction Method of Board-Level Electronic Products

When applying the manual-based reliability prediction method to board-level circuit, the result is quite different from the real engineering scenario and just used as qualitative guidance. Meanwhile the more accurate method based on the physics of failure is hard to apply to the Board-level Electronic Products due to its complexity. Addressing these problems, the paper presents a qualitatively and quantitatively integrative method. The method combines the rapidity of the traditional method and the accuracy of the physics of failure models, and is more suitable for the engineering application.