Packaging chip and signal transmission method based on packaging chip

The embodiment of the invention provides a packaging chip. The packaging chip comprises a packaging structure, a re-wiring structure and a carrier; the packaging structure comprises a first chip and a second chip adjacent to the first chip; the re-wiring structure is used for electrically connecting the first chip with the carrier, and also used for electrically connecting the second chip with the carrier; the re-wiring structure comprises a main body made of insulation material and a concave-convex welding array welded to the lower surface of the main body; the inner part of the main body is provided with a re-wiring metal line group and a mutual connecting metal wire group with bending or inflecting design; the carrier is used for fixing the re-wiring structure, and the lower surface of the carrier is provided with a welding ball or a welding disk or a connector; the upper surface of the main body of the re-wiring structure is bonded with the lower surfaces of the first chip and the second chip; the concave-convex welding array of the re-wiring structure is welded to the upper surface of the carrier. The embodiment of the invention can guarantee short signal access while improve the transmission reliability.