Cladding technique for development of Ag-In-Cd decoupler
2005
Abstract To develop a Ag (silver)–In (indium)–Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 1 h, respectively, for small test pieces ( ϕ 22 mm in diam. × 5 mm in height). Especially, a sandwich case (a Ag–In plate with thickness of 0.5 mm between two Ag–Cd plates with thickness of 1.25 mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
3
References
12
Citations
NaN
KQI