Physical Sputtering of a Copper Anode of a Planar Magnetron by a Beam of Accelerated Argon Ions with an Energy of 1–10 keV

During the approximation of kinetic energy transfer in collision cascades, a numerical estimate of the sputtering coefficient of the copper anode of a magnetron is considered. It has been shown that when a 1–10 keV ion beam is injected into a magnetron, the sputtering coefficient of the copper anode of the magnetron is three to six atoms per incident ion, which makes it possible to introduce and control impurities, in particular copper, under conditions of synthesis of superhard TiN–Cu coatings by reactive magnetron sputtering and directed action on the nanocrystalline structure of the coatings with high accuracy and in small fractional ratios (units of at %).