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Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2 Substrate for All-Wet Metallization Process
Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2 Substrate for All-Wet Metallization Process
2014
Kwang Hwan Kim
Taeho Lim
Myung Jun Kim
Seunghoe Choe
Kyung Ju Park
Sang Hyun Ahn
Oh Joong Kwon
Jae Jeong Kim
Keywords:
Barrier layer
Inorganic chemistry
Substrate (chemistry)
Chemistry
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