Influence of filler orientation and molding temperature on electrical and thermal properties of PMMA/h-BN composite material produced by electrostatic adsorption method

The electrostatic adsorption method can be used to produce composite materials with an arbitrary structure, and their properties may be tuned by changing the size of the individual components, which in turn alters the composition of the material. To develop a thermally conductive and electrically insulating composite material with high thermal conductivity and an acceptable breakdown strength, polymethylmethacrylate (PMMA)/hexagonal boron nitride (h-BN) composite materials were produced by electrostatic adsorption method. The breakdown strength decreases as the molding temperature increases. On the other hand, thermal conductivity increases as the molding temperature increases. In particular, the thermal conductivity of the composite molded at 250 °C drastically increases. It was suggested that the short distance among h-BN and the contact among h-BN led to these properties.