Process for producing multilayers on several levels of electronic chips sets

A method of making a microelectronic device provided with at least one level having a plurality of chips (C1, ..., Cn) stacked on another plurality of chips (C'1, ..., C'n) a lower level, the method comprising the steps of: - performing a first plurality of chips on a first plate (100), - electrical testing of chips (C1, ..., Cn) of the first plurality of chips in order to locate one or more die (s) defective (s) (C2) on the first plate, - fixing on the first plurality of chips of a temporary support (101-102), - separation of the chips to each other by forming trenches (120) around the chips passing through the first plate and exposing the temporary support, - removal of the or said (s) chip (s) defective (s), - assembly of the first plurality of chips with a second plurality of chips (C'1, ..., C'n) resting on a second plate (200).