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Backside failure analysis techniques: What's the gain of silicon getting thinner?
Backside failure analysis techniques: What's the gain of silicon getting thinner?
2014
Christian Boit
N. Schäfer
Daniel Abou-Ras
Clemens Helfmeier
Arkadiusz Glowacki
Uwe Kerst
Keywords:
Analytical chemistry
Electronic engineering
Failure analysis
Hybrid silicon laser
Materials science
Silicon
Correction
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