Fabrication of an efficient metal grating coupler for membrane-based integrated photonics

This paper reports the progress on the fabrication process of highly efficient metal grating couplers for membrane-based integrated circuits, using double side processing technology on bonded samples. This type of gratings comprises a buried SiO2/Ag grating of 125nm thickness with a silver layer as metal mirror, and has several advantages over dielectric gratings as metallic gratings are independent from the buffer thickness. We predict a theoretical chip-to-fiber coupling efficiency of 74% and 89% for uniform and apodized gratings respectively, at a wavelength of 1550 nm. Furthermore, the fabrication process can be used for both, SOI and III-V based platforms.