Connecting structural adhesive composition and the circuit member
2007
The adhesive composition of the present invention comprises (a) a thermoplastic resin, (b) to a molecule having more fluorene structures in a radical polymerizable compound and (c) a radical polymerization initiator.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI