Three-dimensional topography using an X-ray microbeam and novel slit technique

This paper describes section topography using an X-ray microbeam and a novel slit having a V-shaped crevice (V-slit). The V-slit is characterized by a sharp-pointed exponential transmission curve, which enables depth-resolved imaging with high spatial resolution. An iterative deconvolution for image restoration is effectively executable, providing submicron resolution in cross-sectional diffraction imaging. The new method is applied to the analysis of screw dislocation in a SiC diode.