Triple-Stacked Wafer-to-Wafer Hybrid Bonding for 3D Structured Image Sensors
2019
We propose a triple-stacked wafer-to-wafer hybrid bonding technique for image sensor 3D integration by repeating (1) embedment of gold electrode sites, (2) Au/SiO 2 bonding with a thin Si layer in between, and (3) subsequent lost-wafer processes.
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
3
References
0
Citations
NaN
KQI