The multi-dimension co-design for the package of the high-speed multi-function chip

in this paper, a kind of high-speed multi-function chip is packaged. Different from the general chip, the chip includes multiple high-speed parts and extremely high-density pins. Based on the package of the chip, a multi-dimension codesign method is proposed, which includes chip-package-PCB co-design and electrical/thermal co-design of the package. Ultimately, the packaged chip is tested and it could normally read and write data from the registers at the 25°C ambient temperature, which indicates that the multi-dimension package co-design is feasible for the chip.