A high-uph epoxy conductive adhesive and preparation method

The present invention discloses a high UPH epoxy conductive adhesive and its preparation method comprises the following components according to weight percentage: 10% to 15% of an epoxy resin, 2% to 8% of the curing agent, 5% to 10 % diluent, from 1% to 5% of a curing accelerator, 45% to 55% silver and 15% to 25% of the modified alumina powder, and a method for preparing the above-mentioned components are sufficiently mixed. Silver modified alumina used to make glue stick crystal system time to reach the minimum level by selecting the surface properties, size, morphology thixotropic agent powder particles affect the rheological properties of three silver plastic, silver plastic makes contact variable index increased from 5.7 up to 7.0 high thixotropic level.