Fast Simulation of transient temperature distributions in power modules using multi-parameter model reduction

In this paper, a 3-D model with multi-parameter order reduction is applied to the thermal modelling of power electronics modules with complex geometries. Finite elements (FE) or finite difference methods (FDM) can be used to establish accurate mathematical models for thermal analyses. Unfortunately, the resulting computational complexity hinders the analysis in parametric studies. The paper proposes a parametric order reduction technique that can significantly increase simulation efficiency without significant penalty in the prediction accuracy. The method, based on the block Arnoldi method, is illustrated with reference to a multi-chip SiC power module mounted on a forced air cooled finned heatsink with variable mass flow rate.