Characterization and simulation on the cure behavior of epoxy resin for encapsulation structure

Based on simulation method which sequentially couples the heat transfer-cure and stress deformation modules for cure behavior, cure-related parameters were tested using adequate approaches for medium-high temperature curing resin E39D. In combination with reasonable hypotheses, curing resin property parameters or model which are related to heat transfer-cure and stress deformation modulus were derived. Then, finite element model of typical encapsulation structure containing E39D resin was built to simulate evolution of temperature and stress of the chosen point in the encapsulation structure, and the experimentally measured temperature and stress curves of the chose point were also given by means of Fiber Bragg Grating (FBG) monitoring technique. It can be observed that 8.2% maximum discrepancy in temperature and 17.3% maximum discrepancy in strain between experimental and numerical results exist, showing the validity of accepted assumptions and characterization methods.