Thermal stability and decomposition of the HfO2–Al2O3 laminate system

The thermal stability of the HfO2–Al2O3 laminate gate stack grown by atomic layer chemical vapor deposition was investigated using medium-energy ion scattering spectroscopy and high-resolution x-ray photoelectron spectroscopy. The laminate structure was maintained up to 800 °C under ultrahigh vacuum conditions, while it was drastically degraded at 850 °C, resulting in silicide formation on the film surface. Dissociated oxygen in the Hf–Al-oxide preferentially diffuses out through the film and desorbing at the surface. Volatile SiO species and Al–O components desorb through the sample surface, while HfO2 contributes to Hf silicide formation on the film surface.