Old Web
English
Sign In
Acemap
>
Paper
>
直徑30 µm微凸塊的冶金、電遷移、熱循環測試的可靠度議題研究
直徑30 µm微凸塊的冶金、電遷移、熱循環測試的可靠度議題研究
2016
xiewanlin
chenzhi
Chih Chen
Keywords:
Metallurgy
Electromigration
Soldering
Materials science
thermal aging
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]