A Wafer Transfer Technology for Integration of RF MEMS and CMOS on Organic Substrate

A thermal bonding based wafer transfer technology was developed and successfully applied to integrate RF MEMS switch and CMOS ICs on an organic substrate. The major process modules and challenges in this transfer technology are discussed. By integrated together on the new substrate, the RF-MEMS switch illustrates significantly improved performance, and the CMOS show preserved functionality. This technology demonstrates the feasibility and potential applicability of building high performance, compact RF system for wireless communication.