Semiconductor laser cooling heat sink device

The invention relates to the technical field of semiconductor laser arrays, and discloses a semiconductor laser cooling heat sink device. The semiconductor laser cooling heat sink device comprises a water inlet side cover, a water inlet layer, a guide layer, a water return layer and a water return side cover, which are sequentially arranged, wherein a water inlet hole is formed in the outer surface of the water inlet side cover; a water outlet hole is formed in the outer surface of the water return side cover; a slow flow region for slowing down the flow rate of a heat-conducting medium is formed among the water inlet side cover, the water inlet layer and the guide layer; a plurality of through holes through which the heat-conducting medium flows into the water return layer from the slow flow region are formed in one side, close to a semiconductor laser in the guide layer; and a water outlet channel through which the heat-conducting medium flows outside is also formed among the guide layer, the water return layer and the water return side cover. The semiconductor laser cooling heat sink device provided by the invention is a 3D printing integrated forming device; thermal stress and thermal resistance caused by welding of various layers in the prior art are avoided; heat-sink blocking due to the fact that a gold-plated material on the inner wall of the device falls off is also avoided; and the heat exchange efficiency is improved.