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F.E. Analysis of warpage for LED encapsulation silicone considering cure reaction rate
F.E. Analysis of warpage for LED encapsulation silicone considering cure reaction rate
2011
M.J Song
H.K. Kim
G. S. Yoon
K H Kim
Keywords:
Reaction rate
Encapsulation (computer programming)
Viscoelasticity
Silicone
Silicone resin
Composite material
Materials science
Correction
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