Process Development and Characterization for Integrating Microchannel into TSV Interposer

Thermal management is a key challenge for TSV (through-silicon-via) enabled integrated three-dimensional microsystem and integrated microchannel cooling is believed as a promising technology because of high inner-chip cooling efficiency. In this paper, a compatible process is presented for integrating microchannel into TSV interposer and three typical types of integrated microchannel are implemented based on the developed process. And the three types of microchannel design evaluated in term of cooling efficiency under typical thermal loads by simulation results. Furthermore, electrical path composed of TSVs is modeled and simulated, coupling influence of integrated microchannel on electrical performance of the TSV path is analyzed.