Low cost DTV-SoC system implementation using integrated Signal Integrity Analysis

Analysis of signal integrity and power integrity are very important to fill the gap between the high performance and the low cost of the DTV system including chip, package and board. In this paper, an integrated signal integrity analysis method which comprises the interaction among power networks, signal operations, and circuit structures of the full system is introduced. The experimental results present excellent correlation between the measurement and results of simulations. The proposed approach is an effective leverage to determine the performance of the system before manufacturing.