Effect of temperature on failure mode of solder joint under vibration loading condition

In this study, effect of temperature on failure mode of Sn3.0Ag0.5Cu (SAC305) solder joint was studied under vibration loading. Statistical results indicated that crack mainly occurred in IMC /copper pad and IMC/ bulk solder under single vibration loading. The dominant failure mode was crack of IMC. While under temperature-vibration hybrid loading, crack path shifted from IMC to bulk solder. The dominant failure mode was crack within bulk solder and mixed crack of IMC and within bulk solder. Moreover, failure process of crack propagation was digitally featured using self-designed data acquisition system.