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Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading
Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading
2021
Marta Kuczynska
Ulrich Becker
Youssef Maniar
Steffen Weihe
Keywords:
continuous dynamic
Composite material
cyclic loading
Connection (mathematics)
Soldering
Materials science
numerical modeling
Recrystallization (geology)
Correction
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