Numerical analysis of passive heat sink for different shapes

Abstract The main purpose of this work is to present the best heat sink cooling of electronic equipment. The best choice of heat sink depends on certain geometric parameters such as the fin’s height, the length of the fin, the thickness of the fin, the number of fins, the shape or profile of the fin, the material, etc. The optimizing of the fin by different types of fins are taken for heat sink analysis. It is perceived from the results that the optimum cooling is achieved by the heat sink design, which contains interrupted fins. These heat sink designs promise to keep the electronic circuit cooler than a standard heat sink and reduce costs due to the decrease in the material.