Methods for analyzing the reliability of mounting microelectronic radio components

According to modern standards of the radio-electronic industry, manufacturers have to use more and more lead-free technology for soldering nodal joints in produced electronic equipment for various purposes. But with the use of lead-free solders, the question arose about their reliability in comparison with their lead counterparts. It is just about the study of the reliability of lead-free solders that is described in this article. For these purposes, such brands of lead-free solders were investigated as SAC 0107, SAC 0307, SAC 0807, SAC 105, SAC 263, SAC 305, SAC 405, SAC 387, SAC 396. The main differences between linear regression analyses of the reliability of lead-free solder based on the characteristics of the solder and under the influence of thermal cycles based on the Weibull distribution are substantiated. The results of the research are presented at the end of the article in the form of graphical figures and tables.