Influence of Indium on Microstructure and Properties of Sn-Pb Binary Alloy Applied in Photovoltaic Ribbon

In this work, the conductivity, melting point, microstructure, spreading behavior, and mechanical properties of three types of Sn-Pb-In(indium) alloys are investigated along with Sn60Pb40 alloy as a reference. The results show that the In element improves the comprehensive properties of the Sn-Pb alloys. The maximum conductivity of the Sn-Pb-In alloys is 7.08 MS/m when the content of the In element is 3 wt.%. With an increasing content of the In element, the melting points of the Sn-Pb-In alloys gradually decrease from 183 to 166 °C. The microstructures of the alloys are refined with the addition of In. The intermetallic compound (IMC) InSn4 is only found in Sn60Pb34In6, except for the α-Pb and β-Sn phases. A spread test shows that only IMC Cu6Sn5 is present at the Cu/solder interface of the solder joints. The Sn60Pb34In3 solder joint shows the highest ultimate tensile strength of 54 MPa. The microhardness of the alloys slightly increases from 12.76 HV0.05 to 13.56 HV0.05 with the In content increasing from 0 to 3 wt.%, while a sharp increase to 15.53 HV0.05 is observed when the amount of In exceeds 3 wt.%.