Perspective: experiential education in new product design and business development 2 2 The authors g

A semiconductor component has one or more semiconductor chips with contact pads, a number of substrate layers, component contacts and conductor tracks which establish the electrical connection between the contact pads of the semiconductor chip and the component contacts. The substrate layers are respectively provided with conductor tracks and at least one opening and the chip or chips are placed in the opening. A plurality of substrate layers are interconnected lying above one another. The conductor tracks of respective substrate layers end in an area in the vicinity of the at least one semiconductor chip and in an edge area of the respective substrate layer.