Development of new FIB technology for EUVL mask repair
2011
The next generation EUVL masks beyond hp15nm are difficult to repair for the current repair technologies including
focused ion beam (FIB) and electron beam (EB) in view of the minimum repairable size. We developed a new FIB
technology to repair EUVL masks. Conventional FIB use gallium ions (Ga + ) generated by a liquid metal ion source
(LMIS), but the new FIB uses hydrogen ions (H 2 +) generated by a gas field ion source (GFIS). The minimum reaction
area of H 2 + FIB is theoretically much smaller than that of EB. We investigated the repair performance of H 2 + FIB. In the
concrete, we evaluated image resolution, scan damage, etching rate, material selectivity of etching and actinic image of
repaired area. The most important result is that there was no difference between the repaired area and the non-repaired
one on actinic images. That result suggests that the H 2 + GFIS technology is a promising candidate for the solution to
repair the next generation EUVL masks beyond hp15nm.
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