Fabrication of Full-3D Printed Electronics RF Passive Components and Circuits

This paper presents a process for full-3D circuit and RF passive component fabrication based on two main steps: additive manufacturing of the plastic or ceramic substrate, through a stereolitographic 3D printer, and a copper electroless plating metallization process. The metallization results are discussed in terms of resistivity, comparing them to the State-of-the-Art on 3D printed electronics. The capabilities and accuracy of the process have been demonstrated and discussed through the fabrication of conical inductors.