A Test Method for Large-size TSV Considering Resistive Open Fault and Leakage Fault Coexistence

Large-size TSV has larger parasitic capacitance, which leads to more resolution challenges. Meanwhile, due to the opposite effect of resistive open fault and leakage fault in the ring oscillator, the coexistence of two types of faults will cause serious test confusion. These problems lead to significant difficulty of TSV test. In this paper, a test method using Schmitt trigger as TSV receiver is presented to enhance test resolution for large-size TSVs and reduce test confusion when two kinds of faults exist simultaneously. Schmitt trigger that is characterized by two threshold voltages is used to improve the test resolution, and then reduce the supply voltage to check whether the ring oscillator oscillates or not so as to dealing with fault coexistence. HSPICE simulation results based on 45nm CMOS technology demonstrate that the proposed method offers better test resolution compared with the existing similar methods, and can distinguish the misdiagnosis when there are two kinds of faults existing simultaneously in a TSV.