The new vertical continuous transport equipment, U-VCPS

Nowadays, electronic products have been trended to light and thin. The circuit board productions are also thinner. The substrates, whose thickness is from 0.2 mm to 0.1 mm, even to 0.06 mm, are mass production in lots of board mills. However, the yield is limited by the type of production; it cannot avoid contacting with the plate surface. In horizontal production line, the boards are usually crushed, scratched, and even stuck. In gantry production line, there are some problems such as making the jig, automated production, and damaged sheet by personnel operated when loading or unloading. It is impossible to produce by those two ways mentioned above, if the substrate thickness is 0.06 mm or less. This article introduced the new vertical continuous transport equipment, U-VCPS, which can produce the substrate to a thickness of 0.03 mm or less. U-VCPS applies to the desmear process and the electroless copper process, and it can fully meet the demand for contact free. By the closed equipment production line, it can reduce the impact of the external environment risks, and its simple structure is easy to maintain. It can effectively reduce the amounts of solution dropped out when boards transported, so the unnecessary reagent costs is reduced. Moreover, it can rapidly increase the thickness of electroless copper in hole. Therefore, it is exactly an ideal thin plate production equipment for low cost and high quality.