Development, Integration and Qualification of a Measurement System for Accurate and Fast Placements of Flipchips

A positioning system has been developed that places dies quickly and with high accuracy on a rigid substrate. The increased accuracy makes it possible to stack dies, or use dies with an ultra fine pitch, while not sacrificing speed. A single camera system determines the position of the die on the bondhead, as well as the position of the substrate. As a result, the effect of thermal drift is minimized. In order to decrease the cycle time, the camera system is mounted on the bondhead, so that the die position can be measured while moving. This concept has been successfully integrated and tested on an existing component mounter machine. The resulting accuracy has been increased from 10 to 3 μm (3σ), while the placement cycle time can be reduced by 20 %. © (2012) Trans Tech Publications.