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Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints
Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints
2021
Zhai Xinmeng
Chen Yue
Yuefeng Li
Jun Zou
Mingming Shi
Bobo Yang
Yang Li
Chunfeng Guo
Rongrong Hu
Keywords:
thermal reliability
Materials science
Soldering
Particle size
Composite material
Correction
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