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Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process
Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process
2015
Thomas Tillocher
Floriane Leroy
Liping Zhang
Philippe Lefaucheux
Koichi Yatsuda
Kaoru Maekawa
Jean-Francois de Marneffe
Mikhaïl Baklanov
Remi Dussart
Keywords:
Plasma
Reactive-ion etching
Etching
Porosity
Materials science
Composite material
Analytical chemistry
Correction
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